
Transfer Static Pressure Equipment
Used for mid-to-low temperature vacuum bonding of glass, wafers, crystals, sapphires, and similar substrates.

Transfer Static Pressure Equipment
Sale price¥10,000.00
Product specification
Heating Temperature
Room Temperature - 260°C (adjustable)
Rated Power
4kW
Compressed Air/N2 Pressure
0.6 MPa
Downward Pressure
0-10 kN
Leak Rate
Less than 1.0 × E-9 Pa·m³/s
External Dimensions
465 × 540 × 850 mm
Electrical Cabinet Dimensions
450 × 310 × 180 mm
Weight
85 kg
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