Transfer Static Pressure Equipment


Used for mid-to-low temperature vacuum bonding of glass, wafers, crystals, sapphires, and similar substrates.

Product specification

Heating Temperature

Room Temperature - 260°C (adjustable)

Rated Power

4kW

Compressed Air/N2 Pressure

0.6 MPa

Downward Pressure

0-10 kN

Leak Rate

Less than 1.0 × E-9 Pa·m³/s

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